Process Engineer – Aluminium Wire Bonding

About the role

STMicroelectronics is looking for a Process Engineer to manage and optimise the aluminium wire‑bonding manufacturing process. You will ensure high assembly yields, maintain statistical process control, and support new product introductions while collaborating with internal and external stakeholders.

Key responsibilities

• Manage the aluminium wire‑bonding process, monitoring SPC, Cpk, and FMEA RPN metrics.
• Analyse quality gate results, 8D boards, and audit outcomes for both internal and external customers.
• Provide technical support and guidance on process implementation to meet specifications.
• Support new product development and ensure proper rollout of established processes.
• Track production lots on a daily, weekly, monthly and quarterly basis, leading MRB meetings and root‑cause identification.
• Conduct deep technical analysis, propose and lead process optimisations, and execute Design of Experiments (DoE) related to wire bonding.

Required profile

• Process Engineer background in mechanics or electronics.
• Minimum 3 years of industry experience.
• Familiarity with JMP or other simulation tools.

Required skills

• Aluminium wire bonding process
• Statistical Process Control (SPC) and Cpk analysis
• Failure Mode and Effects Analysis (FMEA) and RPN tracking
• 8‑D problem‑solving methodology
• Material Review Board (MRB) participation
• Design of Experiments (DoE)
• JMP software
• Simulation tools

What we offer

• Opportunity to work in a global semiconductor leader recognised as a 2025 Global Top Employer.
• Inclusive, diverse workplace with strong focus on ethics, sustainability and career development.