Process Engineer – Die Attach Process

About the role

STMicroelectronics is seeking a Process Engineer to lead the Die Attach process (glue, soft solder, solder paste) within its semiconductor manufacturing operations. The role combines technical support, process optimisation and project leadership to ensure product quality, yield and cost targets.

Key responsibilities

• Provide technical support and guidance for process implementation and analysis to meet specifications.
• Develop and qualify new products, materials and equipment, ensuring proper integration into manufacturing.
• Identify, modify and upgrade processes and controls to achieve quality standards, yield goals and milestone timelines.
• Lead a technical team on improvement projects and coordinate with manufacturing and quality programmes.
• Ensure EHSE (environment, health, safety, environment) requirements are addressed for new products and processes.

Required profile

• Engineering or Master’s degree with at least 3 years of process‑engineering experience.
• Strong knowledge of semiconductor assembly processes, especially Die Attach.
• Proven ability to manage multiple projects, work autonomously and interact with senior management.
• Leadership and communication skills for multicultural teams.
• Business‑level proficiency in English.

Required skills

• Die Attach process (glue, soft solder, solder paste)
• Material and machine qualification
• Statistical analysis tools
• MS Office and Power BI
• PMP certification
• Six Sigma certification
• EHSE compliance knowledge