Process Engineer – Front‑End Line Industrialization

About the role

STMicroelectronics is looking for a Process Engineer to coordinate front‑end line process industrialisation for new semiconductor products and packages. You will ensure that wafer preparation, laser grooving, wafer sawing, die‑attach and glue‑curing processes meet quality standards, milestones and budget constraints.

Key responsibilities

• Coordinate front‑end line activities such as wafer preparation, laser grooving, wafer sawing, die‑attach glue/soft solder/solder paste‑glue curing for new products.
• Ensure quality standards and target milestones are achieved while operating within defined budgets.
• Manage development projects for critical products, including new material qualification, process changes and cost‑per‑item (CPI) improvements across the assembly line.
• Lead assembly‑related innovation activities (proof‑of‑concept, R&D support, patents, technical papers) and act as the main interface with the GTR&D organization.
• Lead task‑forces focused on process improvement for new projects.

Required profile

• Strong technical knowledge of semiconductor assembly processes.
• Strategic thinking, leadership and analytical problem‑solving abilities.
• High degree of autonomy in technical decision‑making.
• Experience interacting with senior management for strategic alignment.
• Managerial responsibility for a team of engineers, providing guidance and mentorship.
• Minimum 5 years of experience in semiconductor, electronics or automotive domains.
• Proficiency in English for business communication.
• PMP or Six Sigma certification is an advantage.

Required skills

• Wafer preparation
• Laser grooving
• Wafer sawing
• Die‑attach processes
• Glue curing
• Material qualification
• Process change management
• Cost‑per‑item (CPI) optimisation
• Statistical analysis tools
• MS Office
• PowerBI
• PMP certification (optional)
• Six Sigma certification (optional)