Process Engineer – WireBond & Plasma

About the role

STMicroelectronics is seeking a Process Engineer to support WireBond and Plasma processes within its semiconductor manufacturing operations. The role involves technical support, process implementation, and ensuring compliance with quality and environmental standards.

Key responsibilities

• Provide technical guidance for WireBond (Gold and Copper) and Plasma processes to meet specifications.
• Support new product development and ensure proper implementation of established manufacturing processes.
• Perform material and equipment qualification, process upgrades, and continuous improvement initiatives.
• Lead technical teams on improvement projects and coordinate with quality programs.
• Ensure EHSE (environment, health, safety, and environment) considerations are integrated into new product and process introductions.

Required profile

• Engineer or Master’s degree in a relevant field.
• Minimum 3 years of experience in process engineering, preferably in semiconductor assembly.
• Strong analytical and problem‑solving abilities with a strategic mindset.
• High level of autonomy in technical decision‑making and ability to interact with senior management.
• Leadership skills to manage multicultural technical teams.

Required skills

• WireBond and Plasma process knowledge.
• Proficiency with MS Office and PowerBI.
• Experience using statistical tools and software for process analysis.
• PMP certification (preferred).